Karaban Vadim Mihaylovich
Articles:
- Mathematical models of multi-layer printed circuit boards for thermal modeling of electronic devices and systems
- Numerical simulation of stress-strain states of a low temperature jointly-burning ceramics module caused by thermal modes of onboard electronic equipment. Part 1. The problem statement. Preparations for the simulation
- Numerical simulation of stress-strain states of a low temperature jointly-burning ceramics module caused by thermal modes of onboard electronic equipment. Part 2. Numerical simulation
- Product quality improvement by using the cause-and-effect diagram in complex with information system of semiconductor production control
- Research and choice of the law of automatic temperature control of hybrid integrated circuits based on mathematical modeling
- Topological routine and analysis of the multipurpose electronic module scheme
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