Abstract: A technique for numerical simulation of stress-strain states, which result from the thermal loads impacts, is developed. The technique is intended for reliable forecast of durability of the low temperature jointly-burning ceramics module at early stages of its creation.
Keywords: numerical simulation, thermal modes, stress-strain state, low-temperature ceramics module, ansys workbench, onboard electronic equi pment
Authors and copyright holders:
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For citation:
Alekseev V. P., Karaban V. M., Ponomarev S. V., Suntsov S. B. Numerical simulation of stress-strain states of a low temperature jointly-burning ceramics module caused by thermal modes of onboard electronic equipment. Part 2. Numerical simulation. Doklady Tomskogo gosudarstvennogo universiteta sistem upravleniya i radioelektroniki, 2010, no. 2(22), – p. 1. pp. 232–235.
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