Mathematical models of multi-layer printed circuit boards for thermal modeling of electronic devices and systems

Abstract: The work deals with the implementation of thermal models of printed circuit boards, which are determined by the object model, the required accuracy of the results, as well as the speed and complexity of their receipt.

Keywords: mathematical model, circuit board, trace, joule heat

For citation:
Karaban V. M., Suhorukov M. P., Morozov E. A. Mathematical models of multi-layer printed circuit boards for thermal modeling of electronic devices and systems. Doklady Tomskogo gosudarstvennogo universiteta sistem upravleniya i radioelektroniki, 2013, no. 3(29), pp. 170–174.