Numerical simulation of stress-strain states of a low temperature jointly-burning ceramics module caused by thermal modes of onboard electronic equipment. Part 1. The problem statement. Preparations for the simulation

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Authors: Alekseev V. P., Karaban V. M., Ponomarev S. V., Suntsov S. B.

Annotation: A technique for numerical simulation of stress-strain states, which result from the thermal loads impacts, is developed. The technique is intended for reliable forecast of durability of the low temperature jointly-burning ceramics module at early stages of its creation.

Keywords: numerical simulation, thermal modes, stress-strain state, low-temperature ceramics module, ansys workbench, onboard electronic equi pment