Modeling the influence of heterostructure barrier layer thickness on the breakdown voltage of high electron mobility transistor

DOI: 10.21293/1818-0442-2025-28-1-81-85

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Abstract: The paper presents the results of modeling the breakdown occurrence in the heterostructure of a high electron mobility transistor at different thicknesses of the AlGaAs barrier layer. As a result of the study, it was revealed that the breakdown voltage, measured by the drain current injection method, is 8,75 V at the specified parameters of the heterostructure and remains unchanged when the thickness of the barrier layer changes

Keywords: breakdown voltage, heterostructure, pHEMT, drain current injection, barrier layer

Funding: This work was supported by the Ministry of Science and Higher Education of the Russian Federation under project FEWM 2024-0004.

For citation:
Shesterikova D. A., Shesterikov A. E., Erofeev E. V., Troyan P. E. Modeling the influence of heterostructure barrier layer thickness on the breakdown voltage of high electron mobility transistor. Doklady Tomskogo gosudarstvennogo universiteta sistem upravleniya i radioelektroniki, 2025, vol. 28, no. 1, pp. 81–85. DOI: 10.21293/1818-0442-2025-28-1-81-85

Authors and copyright holders:

  • Shesterikova D. A. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)
  • Shesterikov A. E. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)
  • Erofeev E. V. , JSC «NPF Micran» (Tomsk, Russia)
  • Troyan P. E. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)

  • 1. Uko M., Ekpo S. A 23-28 GHz pHEMT MMIC lownoise amplifier for satellite-cellular convergence applications. International Review of Aerospace Engineering Journal, 2021, vol. 14, no. 5, pp. 1–10.
  • 2. Laaouane H., Bri S., Foshi J. Design of a low noise amplifier based on E-PHEMT transistors for 4G applications. Journal on Computer Science and Information Technologies, 2021, vol. 5, no. 2, pp. 41–52.
  • 3. Kamsaini F., Razalli M.S., Ibrahim S.Z., Ilyas M.Z. Design and Development of Two-stage Low-noise Amplifier (LNA) using E-pHEMT Technology for C-band Application. IOP Conference Series: Materials Science and Engineering, IOP Publishing, 2020, vol. 864, no. 1, pp. 012126.
  • 4. Wild A. Microelectronics in the 21st Century: Technology, Economics, Policies. 2022 International Semiconductor Conference (CAS), Poiana Brasov, Romania, 2022, pp. 3–12.
  • 5. Zheng R., Xue Z., Li C., Tang S. Research on damage effects of pHEMT low noise amplifiers under HPM injection. IEICE Electronics Express, 2024, pp. 21.20240525.
  • 6. Popov A.A., Bilevich D.V., Metel A.A., Salnikov A.S., Dobush I.M., Goryainov A.E., Kalentyev A.A. Small-signal and noise GaAs pHEMT modeling for low noise amplifier design. Journal of Physics: Conference Series, IOP Publishing, 2020, vol. 1499, no. 1, pp. 012033.
  • 7. Fuxing L., Changchun C., Han W., Lei W., Qishuai L., Qi A., Yintang Y. Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier. Microelectronics Reliability, 2022, vol. 128, pp. 114427.
  • 8. Menozzi R. Off-state breakdown of GaAs PHEMTs: review and new data. IEEE Transactions on Device and Materials Reliability, 2004, vol. 4, no. 1, pp. 54–62.
  • 9. Ajayan J., Nirmal D., Mohankumar P., Tayal S. An Overview of Nanowire Field-Effect Transistors for Future Nanoscale Integrated Circuits. Nanoelectronics for Next-Generation Integrated Circuits, 2022, pp. 81–114.
  • 10. Ajayan J., Ravichandran T., Mohankumar P., Prajoon P., Pravin J.C., Nirmal D. Investigation of DC-RF and breakdown behaviour in Lg= 20 nm novel asymmetric GaAs MHEMTs for future submillimetre wave applications. AEUInternational Journal of Electronics and Communications, 2018, vol. 8, pp. 387–393.
  • 11. Packeer Mohamed M.F., Mohamed Omar M.F., Akbar Jalaludin Khan M.F., Ghazali N.A., Hairi M.H., Falina S., Samsol Baharin M.S.N. New Submicron Low Gate Leakage In0.52Al0.48As-In0.7Ga0.3As pHEMT for Low-Noise Applications. Micromachines, 2021, vol. 12, no. 12, pp. 1497.
  • 12. Bahl S.R., Del Alamo J.A. A new drain-current injection technique for the measurement of off-state breakdown voltage in FETs. IEEE Transactions on Electron Devices, 1993, vol. 40, no 8, pp. 1558–1560.
  • 13. Shesterikov A.E., Shesterikova D.A., Erofeev E.V. [Study of design and technological features of manufacturing of low-noise GaAs-transistors with T-gate length of 150 nm for information transmission systems]. Semiconductor Physics and Technology, 2024, no. 3, pp. 144–150 (in Russ).
  • 14. Grasser T., Tang T.W., Kosina H., Selberherr S.A review of hydrodynamic and energy-transport models for semiconductor device simulation. Proceedings of the IEEE, 2003, vol. 91, no. 2, pp. 251–274.
  • 15. Reggiani L., Starikov E., Shiktorov P., Gruzinskis V., Varani L. Modelling of small-signal response and electronic noise in semiconductor high-field transport. Semiconductor Science and Technology, 1997, vol. 12, no. 2, pp. 141.
  • 16. Khanna V.K. Physical understanding and technological control of carrier lifetimes in semiconductor materials and devices: A critique of conceptual development, state of the art and applications. Progress in Quantum Electronics, 2005, vol. 29, no. 2, pp. 59–163.
  • 17. Palma J.F. Breakdown behavior and optimization of AlGaAs/InGaAs pseudomorphic high electron mobility transistors. University of Massachusetts Lowell, 2011, p. 253.
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