The calculation heat-removing and substrate coat for the process of creation light-emitting diodes

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Abstract: Estimate of influence thickness layer of invar, was inducted between copper substrate and heterostructure of high power light-emitting diode, on neutralization of mechanical stress in structure.

Keywords: factor of linear temperature dilating, mechanical stress, thermal stream, vector of travels

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For citation:
Zhidik Yu. S., Troyan P. E., Karimbaev D. D. The calculation heat-removing and substrate coat for the process of creation light-emitting diodes. Doklady Tomskogo gosudarstvennogo universiteta sistem upravleniya i radioelektroniki, 2011, no. 2(24), – p. 2. pp. 73–76.

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