An influence analysis of technological process of the multilayered integrated circuits manufacturing with the use of low burning temperature ceramics on the stress-strain state simulation results of the onboard electronic equipment modules. Review

Abstract: The technological processes for manufacturing the multilayered integrated circuits based on low tem- perature burning ceramics are considered. The analysis of their influence on the computer simulation results of the stress-strain state and, as a consequence, the durability of onboard electronic equi pment, is carried out.

Keywords: multilayered integrated circuits, low burning temperature ceramics, production technology, microwave technology, stress-strain state, radioelectronic equi pment

For citation:
Ponomarev S. V., Suntsov S. B. An influence analysis of technological process of the multilayered integrated circuits manufacturing with the use of low burning temperature ceramics on the stress-strain state simulation results of the onboard electronic equipment modules. Review. Doklady Tomskogo gosudarstvennogo universiteta sistem upravleniya i radioelektroniki, 2010, no. 2(22), – p. 1. pp. 207–209.