Comparison of the effectiveness of cross-coupling reduction methods in PCB transmission lines

Authors and copyright holders:

• Skornyakov I. A. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)
• Karri S. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)
• Surovtsev R. S. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)
• Mandel A. E. , Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)

• 1. Nagirnaya A.V. Printsipy razvitiya global'nogo informatsionnogo prostranstva [Principles of development of the global information space]. Fundamental research, 2013, no. 6, рart 6, pp. 1462–1467 (in Russ.).
• 2. Volin M.L. Parazitnyye protsessy v radioelektronnoj apparature [Parasitic processes in radio-electronic equipment]. – 2nd ed., revised and enlarged. M: Radio and communication, 1981, 296 p. (in Russ.).
• 3. Liu J., Zhang M., Hu G. Analysis of Power Supply and Signal Integrity of High-Speed PCB Board. IEEE 8th Joint International Information Technology and Artificial Intelligence Conference (ITAIC), Chongqing, China, 2019, pp. 412–416.
• 4. Wu X., Geng D., Liu Y., Huang C. Signal integrity analysis of chip package based on machine learning. Proc. of Fifth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Mechatronics (MEIMM 2024), 2024, pp. 2–4.
• 5. Gizatullin Z.M. Snizheniye elektromagnitnyh pomekh v mezhsoyedineniyah mnogoslojnyh pechatnyh plat [Reduction of electromagnetic interference in interconnections of multilayer printed circuit boards]. Bulletin of the Kazan State Technical University named after A.N. Tupolev, 2012, no. 2, pp. 199–205.
• 6. Gizatullin Z, Gizatullin R. Crosstalk in Interconnects of Multilayer Printed Circuit Boards in the Form of Twisted Pairs. International Conference on Indus-trial Engineering, Applications and Manufacturing (ICIEAM), 2023, pp. 261–265.
• 7. Guillette D.S., Clarke J. Intentional electromagnetic irradiation of a microcontroller. Proc. of IEEE International conference on electromagnetics in advanced applications, Granada, Spain, 2019, pp. 1214–1218.
• 8. Zhechev Y.S., Medvedev A.V., Gazizov T.R. Signal integrity analysis of the structure with single modal reservation before and after failures. IEEE Electromagnetic Compatibility Magazine, 2023, vol. 12, no. 1, pp. 69–73.
• 9. Ilyin A.A., Malyutin N.D., Misyunas A.O., Loschilov A.G. Sintez topologii ustrojstv formirovaniya impul'sov s zadannymi spektral'nymi harakteristikami na osnove neregulyarnyh rel'yefnyh svyazannyh mikropoloskovyh linij [Synthesis of the topology of pulse generation devices with specified spectral characteristics based on irregular relief coupled microstrip lines]. Proceedings of TUSUR University, 2010, no. 2(22), part 1, pp. 7–19.
• 10. Malyutin N.D., Loschilov A.G., Fedorov V.N., Zykov D.D. SHirokopolosnyye diskretnyye nedispersionnyye fazovrashchateli na osnove effekta kratnogo izmeneniya fazovoj skorosti v mnogosvyaznyh poloskovyh strukturah s sushchestvenno neuravnoveshennoj elektromagnitnoj svyaz'yu pri sohranenii soglasovaniya v shirokoj polose chastot [Broadband discrete non-dispersive phase shifters based on the effect of multiple change in phase velocity in multi-connected strip structures with significantly unbalanced electromagnetic coupling while maintaining matching in a wide frequency band]. Proceedings of TUSUR University, 2014, no. 4 (34), pp. 22–30.
• 11. Samoylichenko M.A., Zhechev Y.S., Gazizov T.R. Signal integrity analysis of modal filters formed by modification of microstrip lines and coplanar waveguides. IEEE Electromagnetic Compatibility Magazine, 2024, vol. 13, no. 1, pp. 35–41.
• 12. Kechiev L.N. Proyektirovaniye pechatnyh plat dlya tsifrovoj bystrodejstvuyushchej apparatury [Design of printed circuit boards for digital high-speed equipment]. M.: IDT Group Publ., 2007, 616 p. (in Russ.).
• 13. Joffe E.B., Lock K.S. Grounds for grounding. A circuit-to-system handbook. New York City: John Wiley & Sons Limited Publ., 2018, 1088 p.
• 14. Surovtsev R.S., Gazizov T.R. Optimization of protective varnish thickness to minimize crosstalk in multiconductor bus of spacecraft PCB. Proc. of IEEE Moscow Workshop on Electronic and Networking Technologies, M., Russia, 2018, pp. 1–6.
• 15. Britt D.S., Hockansson D.M., Sha F., Drewniak J.L., Hubing T.H., Van Doren T.P. Effects of gapped ground planes and guard traces on radiated EMI. Proc. of IEEE Int. Symp. on EMC, Austin, USA, 1997, pp. 159–164.
• 16. Rajeswari P., Gobinath A. Performance Analysis of Microstriplines Interconnect Structure with Novel Guard Trace as Parallel Links for High Speed Dram Interfaces. Wireless Personal Communication. 2020, vol. 112, pp. 261–271.
• 17. T.R. Gazizov, S.P. Kuksenko, A.M. Zabolotsky and et al. Certificate of state registration of computer program No. 2024664804. Electromagnetic compatibility computer simulation system TUSUR.EMC (TUSUR.EMC). Application No. 2024663041. Date of receipt 10.06.2024. Registered in the Register of computer programs on 25.06.2024.
• 18. Levkina N., Vantsov S., Medvedev A. Vlagozashchitnyye pokrytiya pechatnyh plat [Moisture-proof coatings of printed circuit boards]. Electronics: Science, Technology, Business, 2018, no. 7, pp. 124–129.